Advanced wafer processing and epitaxial capabilities with extensive experience
in slicing, grinding, polishing, laser processing, and thin-film technologies.
Custom Wafer Solutions
Advanced wafer processing and epitaxial capabilities with extensive experience
in slicing, grinding, polishing, laser processing, and thin-film technologies.
Global Supply Capability
Advanced wafer processing and epitaxial capabilities with extensive experience
in slicing, grinding, polishing, laser processing, and thin-film technologies.
Sustainable Development
Advanced wafer processing and epitaxial capabilities with extensive experience
in slicing, grinding, polishing, laser processing, and thin-film technologies.
Professional Technical Support
Advanced wafer processing and epitaxial capabilities with extensive experience
in slicing, grinding, polishing, laser processing, and thin-film technologies.
Company Profile
The company has established close cooperation and strategic alliances with over 300
companies and research institutes both domestically and internationally. With advanced production
and testing equipment, extensive experience...