Home/ Products / Silicon Carbide Wafer (SiC Wafer) / 4H-N Type
Specification
Item 4H n-type SiC substrate
Size 5*5mm / 10*10mm / 15*15mm / 20*20mm
Thickness 350±25μm
Resistivity 0.014~0.028Ω·cm
Surface Finish Double side polished
Laser Mark Mark "1" on C face


Customization specifications:
* Various sizes and shapes such as 3*3mm

* Various thicknesses: 0.1~20mm

* Various orientations such as Off-Axis:8°toward <11-20>±0.5°

* Various surface roughness such as slicing,lapping,polishing.

* Silicon carbide crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=3.076Å c=10.053Å
Density(g/cm³) 3.21
Melting point(℃) 2830
Mohs Hardness(mohs) 9.2
Dielectric Constant 9.66
Band Gap(eV) 3.26
Breakdown Electrical Field (MV/cm) 3.1
Thermal Conductivity(W/cm·K) 4.5
Thermal Expansion 4.7*10⁻⁶/K
Refractive Index 2.6767 ~ 2.6480
SKU: --
SiC Wafer (5*5mm/10*10mm/15*15mm/20*20mm) (4H-N type, double side polished)
Thickness
  • 5*5mm
  • 10*10mm
  • 5*10mm
  • 15*15mm
  • 20*20mm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Stock: 149999985
Quantity
$0.00 ~ 100.00

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DESCRIPTION
Our 4H-N type silicon carbide square substrates come in four regular sizes including 5×5mm, 10×10mm, 15×15mm and 20×20mm with double-side polishing, featuring low surface roughness to satisfy strict surface requirements for scientific research. Boasting outstanding thermal conductivity, high temperature and voltage resistance as well as stable carriers, these SiC wafers fit high-temperature electrical testing, GaN epitaxy, magnetron sputtering and device packaging prototyping. Developed specially for research and trial production to cut material cost for single samples, the products support customization of thickness and doping parameters, widely applied in laboratories of universities and enterprise R&D departments for small-scale experiments of third-generation semiconductors.
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