Home/ Products / Silicon Carbide Wafer (SiC Wafer) / 4H-N Type
Specification
Item 4H n-type SiC substrate
Diameter 159±0.3mm
Thickness 725±25μm
Surface Orientation Off-Axis:4°toward <11-20>±0.5°
Primary Flat Orientation Parallel to <11-20>±1°
Primary Flat Length Notch
Secondary Flat Orientation N/A
Secondary Flat Length N/A
Resistivity 0.014~0.028Ω·cm
Front Surface Finish Si-Face: CMP, Ra<0.5nm
Back Surface Finish C-Face: Optical Polish, Ra<1.0nm
Laser Mark Back side: C-Face
TTV ≤20μm
BOW ≤60μm
WARP ≤80μm
Edge Exclusion ≤3 mm


Customization specifications:
* Various sizes and shapes such as 10*10mm

* Various thicknesses: 0.1~20mm

* Various orientations such as Off-Axis:8°toward <11-20>±0.5°

* Various surface roughness such as slicing,lapping,polishing.

* Silicon carbide crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=3.076Å c=10.053Å
Density(g/cm³) 3.21
Melting point(℃) 2830
Mohs Hardness(mohs) 9.2
Dielectric Constant 9.66
Band Gap(eV) 3.26
Breakdown Electrical Field (MV/cm) 3.1
Thermal Conductivity(W/cm·K) 4.5
Thermal Expansion 4.7*10⁻⁶/K
Refractive Index 2.6767 ~ 2.6480
SKU: --
Diameter 159mm silicon carbide wafer (4H-N type, double side polished)
Thickness
  • 725μm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Stock: 29999997
Quantity
$800.00 ~ 1,000.00

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DESCRIPTION
159mm 4H-N type silicon carbide wafer with double side polished (DSP) surface. High-quality conductive 4H-SiC single crystal substrate for SiC homoepitaxy, power semiconductor R&D and device manufacturing. Low surface roughness, excellent flatness, available for research grade and production grade customization.
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