Home/ Products / Sapphire Substrate Wafer / C-plane Sapphire Substrate
Specification
Item Sapphire Substrate
Diameter 300.0±0.1mm
Thickness 1000±25μm
Surface Orientation C-plane (0001) off-angle toward M-axis(10-10) 0.2 ± 0.1°
Primary Flat Orientation A-Plane (11-20) ± 1.0°
Primary Flat Length Notch
Front Surface Finish Epi-polished,Ra<0.3nm
Back Surface Finish Epi-polished,Ra<0.3nm
Laser Mark Back side
TTV ≤30μm
BOW ≤40μm
WARP ≤60μm
Edge Exclusion ≤3 mm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Sapphire crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
12 inch Sapphire Substrate (C-plane,Double side polished)
Thickness
  • 1000μm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Surface
  • SSP
Stock: 2999997
Quantity
$1,350.00 ~ 2,500.00

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DESCRIPTION
Epi‑ready 12‑inch (0001) C‑plane sapphire substrate, available with single‑side‑polished or double‑side‑polished surface. Featuring superior flatness, low‑defect surface, high‑temperature endurance and reliable insulating performance. This large‑size wafer is designed for high‑volume GaN epitaxy, Mini‑LED, ultraviolet optoelectronic components and power‑optoelectronic chip manufacturing. Custom miscut angle, wafer thickness and edge finishing are supported.
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