Home/ Products / Sapphire Substrate Wafer / C-plane Sapphire Substrate
Specification
Item Sapphire Substrate
Diameter 200.0±0.1mm
Thickness 500±25μm、1000±25μm
Surface Orientation C-plane (0001) off-angle toward M-axis(10-10) 0.2 ± 0.1°
Primary Flat Orientation A-Plane (11-20) ± 1.0°
Primary Flat Length Notch
Front Surface Finish Epi-polished,Ra<0.3nm
Back Surface Finish Fine-ground,Ra=0.8-1.2μm
Laser Mark Back side
TTV ≤30μm
BOW ≤40μm
WARP ≤60μm
Edge Exclusion ≤3 mm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Sapphire crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
8 inch Sapphire Substrate (C-plane,Single side polished)
Thickness
  • 1000μm
  • 1600μm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Surface
  • SSP
Stock: 5999994
Quantity
$300.00 ~ 550.00

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DESCRIPTION
Epi‑ready 8‑inch C‑plane (0001) sapphire wafer, supplied in single‑side‑polished or double‑side‑polished. It possesses outstanding high‑temperature stability, superior insulation property and ultra‑smooth polished surface. Well‑suited for large‑size GaN epitaxy, high‑power LED, UV‑optoelectronic devices and laser‑chip fabrication. Custom‑made thickness, off‑angle and edge‑processing services are available.
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