Home/ Products / Sapphire Substrate Wafer / C-plane Sapphire Substrate
Specification
Item Sapphire Substrate
Diameter 100.0±0.1mm
Thickness 650±25μm、1000±25μm
Surface Orientation C-plane (0001) off-angle toward M-axis(10-10) 0.2 ± 0.1°
Primary Flat Orientation A-Plane (11-20) ± 1.0°
Primary Flat Length 30.0±1.0mm
Front Surface Finish Epi-polished,Ra<0.3nm
Back Surface Finish Fine-ground,Ra=0.8-1.2μm
Laser Mark Back side
TTV ≤10μm
BOW ≤15μm
WARP ≤20μm
Edge Exclusion ≤3 mm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Sapphire crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
4 inch Sapphire Substrate (C-plane,Single side polished)
Thickness
  • 650μm
  • 1000μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Surface
  • SSP
  • SSP切10*10
Stock: 8999991
Quantity
$0.00 ~ 100.00

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DESCRIPTION
The 4inch sapphire substrate delivers outstanding surface flatness, great infrared‑visible‑ultraviolet light transmittance, excellent high‑temperature resistance and stable chemical inertness. Both polished‑side quality is strictly controlled for low surface roughness and minimal defects.
It is well‑suited for GaN epitaxy, high‑performance LED chips, deep‑ultraviolet photodetectors, thin‑film deposition, optical‑sensor fabrication and scientific‑research experiments. Customizable wafer thickness, edge‑chamfer treatment and surface indexes are available.
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