Home/ Products / Sapphire Substrate Wafer / PSS/NPSS Sapphire Substrate
Specification
Item Patterned Sapphire Substrate
Diameter 150.0±0.3mm
Thickness 1000±25μm
Surface Orientation C-M plane 0.2°
Primary Flat Orientation A-Plane (11-20) ± 1.0°
Primary Flat Length 47.5±2.0mm
Front Surface Finish Patterned
Back Surface Finish Single side polished
Laser Mark Back side
TTV ≤20μm
BOW ≤25μm
WARP ≤30μm
Edge Exclusion ≤3 mm
Pattern Specification Shape Structure Dome, Cone,Pyramid
Pattern Height 1.6~1.8μm
Pattern Diameter 2.75~2.85μm
Pattern Space 0.1~0.3μm
Pattern Micrographs Pattern Micrographs


Customization specifications:

* Nanometer patterned sapphire substrate(NPSS).

* Sapphire PSS of various orientations.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
6 inch Patterned Sapphire Substrate (PSS)
Thickness
  • 1300μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Surface
  • SSP
Stock: 2999997
Quantity
$175.00 ~ 400.00

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DESCRIPTION
High‑purity C‑plane monocrystalline sapphire substrate (150mm diameter) with precision periodic micro‑nano patterned structures. Fabricated by advanced lithography and ICP dry etching technology, featuring excellent pattern uniformity, ultra‑low defect rate and high surface cleanliness. The patterned design effectively suppresses threading dislocation propagation of GaN epitaxy, improves lateral overgrowth quality, and breaks total internal reflection to greatly boost LED light extraction efficiency and luminous uniformity. Ideal for high‑end high‑power LEDs, large‑size Mini‑LED/Micro‑LED displays, automotive lighting and mass semiconductor optoelectronic production. Custom pattern shape, pitch and etching depth are available.
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