Home/ Products / Silicon Carbide Wafer (SiC Wafer) / Silicon Carbide Epitaxial Wafer
Specification
1. Structure



2.Epitaxial Parameters
 
Item Thickness Doping type Doping Concentration
Epitaxial layer 10μm P type/N type 1E14~1E19cm-3
Buffer 1μm N-type 1.00E±18cm-3


3.Substrate Parameters

Substrate Diameter: 50.8±0.3mm
Substrate Thickness: 350±25μm
Substrate Type: 4H-N type

4. Reference: 

1"/2"/3"/ 4"/ 6" SiC substrate(10*10mm etc.) is available.
4H and 6H SiC substrates are available.
Thickness uniformity < 10% 
Wafer Bow<60um,Typical
N-type, p-type or semi-insulating SiC epitaxial layers is available.

Epitaxial structure and substrate specifications can be customized, Contact: anna@jxtwafer.com,shirley@jxtwafer.com

 
 
SKU: --
2 inch SiC on SiC Homoepitaxial Wafer
Thickness
  • 350μm
Epitaxial
  • 10μm
Pieces
  • 1pcs
  • 10pcs
  • 50pcs
Stock: 299997
Quantity
$180.00 ~ 500.00

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DESCRIPTION

Our 2‑inch SiC on SiC epitaxial wafer adopts high‑grade monocrystalline silicon‑carbide substrate, with high‑quality homo‑epitaxial film chemically‑deposited upon the base wafer.

Strict‑controlled epitaxial‑layer thickness, uniform doping concentration and low surface‑defect density guarantee outstanding electrical performance. We supply N‑type and P‑type epitaxial wafers, customizable on epitaxy thickness, doping density and surface finishing.

Perfect for manufacturing SiC‑SBD, MOSFET, power‑switching chips, high‑frequency RF components and laboratory device‑fabrication research.

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