Home/ Products / Sapphire Substrate Wafer / C-plane Sapphire Substrate
Specification
Item Sapphire Substrate(Round)
Diameter D80mm、D104mm、D109mm、D156mm、D159mm
Thickness 1000±25μm
Surface Orientation C-plane (0001) off-angle toward M-axis(10-10) 0.2 ± 0.1°
Front Surface Finish Epi-polished,Ra<0.5nm
Back Surface Finish Epi-polished,Ra<0.5nm
Laser Mark Back side
TTV ≤5μm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
Sapphire carrier substrate (C-plane, double side polished)
Size
  • 3英寸承载片-D80mm纯圆
  • 4英寸承载片-D104mm纯圆
  • 4英寸承载片-D109mm纯圆
  • 6英寸承载片-D156mm纯圆
  • 6英寸承载片-D159mm纯圆
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Thickness
  • 1000μm
Stock: 14999985
Quantity
$40.00 ~ 300.00

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DESCRIPTION
Sapphire carrier substrate is high‑purity single‑crystal Al₂O₃ wafer designed as a temporary supporting carrier for ultra‑thin semiconductor wafers during thinning, polishing, bonding and transferring processes. Featuring excellent thermal stability, chemical corrosion resistance, superior flatness and ultra‑low TTV, our sapphire carrier wafers provide rigid, reliable mechanical support for fragile device wafers. Standard sizes from 2‑12 inches are available, with custom crystal orientation, thickness and surface finishing upon request.
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