Home/ Products / Sapphire Substrate Wafer / Off-axis Sapphire Substrate
Specification
Item Sapphire Substrate
Diameter 100.0±0.2mm
Thickness 650±25μm
Surface Orientation C-A plane 1° OR C-M plane 1°
Primary Flat Orientation A-plane ± 0.3°
Primary Flat Length 30.0±1.0mm
Surface Finish Single side polished
Laser Mark Back side
TTV ≤20μm
BOW ≤25μm
WARP ≤30μm
Edge Exclusion ≤3 mm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Sapphire crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
4 inch C-A plane 1°/C-M plane 1° Sapphire Substrate (Single side polished)
Thickness
  • 650μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Surface
  • SSP
  • SSP切10*10
Stock: 4294967295
Quantity
$50.00 ~ 150.00

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DESCRIPTION
High‑purity monocrystalline sapphire (Al₂O₃), base crystal orientation C‑plane (0001), precisely dual‑direction off‑cut: 1° toward A‑axis (11‑20) and 1° toward M‑axis (10‑10). Epi‑ready polished wafer with tight tolerance on miscut angle, TTV, bow, warp and surface roughness. This 1° dual‑off‑axis substrate generates well‑ordered atomic‑step surface, optimizes epitaxial nucleation, improves layer morphology and reduces dislocation density for GaN, AlN, deep‑UV LED, laser diodes and advanced nitride‑based epitaxy research. Single‑side / double‑side polishing and customized thickness are available.
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