Home/ Products / Sapphire Substrate Wafer / Off-axis Sapphire Substrate
Specification
Item Sapphire Substrate
Diameter 50.8±0.1mm
Thickness 430±25μm
Surface Orientation C-A plane 0.5° OR C-M plane 0.5°
Primary Flat Orientation A-plane ± 0.3°
Primary Flat Length 16.0±1.0mm
Surface Finish Double side polished or Single side polished
Laser Mark Back side
TTV ≤8μm
BOW ≤10μm
WARP ≤12μm
Edge Exclusion ≤3 mm


Customization specifications:

* Various orientations such as A/R/M/N Plane, C off M(1°-10°), C off A(1°-10°).

* Various sizes and shapes such as 10*10mm,12inch

* Various thicknesses: 0.1~20mm

* Various surface roughness such as slicing,lapping,polishing.

* Sapphire crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=4.76Å c=12.99Å
Density(g/cm³) 3.98
Melting point (℃) 2040
Mohs Hardness(mohs) 9
Dielectric Constant 9.3(A plane)
11.5(C plane)
Thermal Conductivity(W/cm·K) 0.46
Thermal Expansion 6.7*10⁻⁶/k(C plane)    5.0*10⁻⁶/k(A plane)
Refractive Index 1.762-1.777
Transmission Test sample:Sapphire: D76.2*4mm
UV:200~380nm  74%~84%
Visible light: 380~760nm  85%
Infrared: 760~1000nm  85%
Far-Infrared: >1000nm  80%~100%
SKU: --
2 inch C-A plane 0.5°/C-M plane 0.5° Sapphire Substrate (Double side polished or Single side polished)
Thickness
  • 4300μm
Pieces
  • 1pcs
  • 25pcs
  • 100pcs
Surface
  • DSP
  • SSP
  • DSP/SSP切10*10
Stock: 89999991
Quantity
$0.00

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DESCRIPTION
High‑purity monocrystalline sapphire (Al₂O₃), base orientation C‑plane (0001), precisely off‑cut 0.5° towards A‑axis (11‑20) and 0.5° towards M‑axis (10‑10). Epi‑ready polished surface with tight tolerance on miscut angle, TTV, bow, warp and surface roughness. The dual‑direction off‑axis design provides well‑defined atomic‑step surface, optimizing nucleation and layer quality for high‑quality GaN, AlN, UVC‑LED, ultraviolet laser and other nitride‑based epitaxial growth. Single‑side / double‑side polishing and customized thickness are available.
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