Home/ Products / Silicon Carbide Wafer (SiC Wafer) / 6H-P/6H-N/3C-N/4H-P Type
Specification
Item 6H-N type SiC substrate
Diameter 50.8±0.3mm
Thickness 330±25μm
Surface Orientation On-Axis {0001} ± 0.2°
Primary Flat Orientation Parallel to <10-10>±5°
Primary Flat Length 16.0±1.5mm
Secondary Flat Orientation Silicon face up: 90° CW. from Primary flat±5.0°
Secondary Flat Length 8.0±1.5mm
Resistivity 0.01-0.02 Ω·cm
Surface Finish DSP
Laser Mark Back side: C-Face
TTV ≤10μm
BOW ≤25μm
WARP ≤30μm
Edge Exclusion ≤3 mm


Customization specifications:
* Various sizes and shapes such as 10*10mm

* Various thicknesses: 0.1~20mm

* Various orientations such as Off-Axis:8°toward <11-20>±0.5°

* Various surface roughness such as slicing,lapping,polishing.

* Silicon carbide crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=3.076Å c=10.053Å
Density(g/cm³) 3.21
Melting point(℃) 2830
Mohs Hardness(mohs) 9.2
Dielectric Constant 9.66
Band Gap(eV) 3.26
Breakdown Electrical Field (MV/cm) 3.1
Thermal Conductivity(W/cm·K) 4.5
Thermal Expansion 4.7*10⁻⁶/K
Refractive Index 2.6767 ~ 2.6480
SKU: --
4 inch 6H-N type silicon carbide wafer
Thickness
  • 350μm
  • 1000μm
  • 3000μm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Stock: 89999991
Quantity
$11.00 ~ 99.00

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DESCRIPTION
4-inch (100mm) 6H-N type SiC substrate wafer with hexagonal crystal structure and nitrogen-doped N-type conductivity with adjustable resistivity. Processed by precision lapping and double-side CMP polishing with controlled micropipe density and surface roughness, perfectly matching MOCVD epitaxy, high-temperature power chips and deep UV optoelectronics fabricationAlibaba.co.... 6H-SiC features outstanding thermal stability, corrosion resistance and extreme temperature tolerance for long-term harsh-environment use. Research grade & mass-production grade are available, customized thickness, orientation and conductivity for academic labs and semiconductor manufacturers.
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