Home/ Products / Silicon Carbide Wafer (SiC Wafer) / 6H-P/6H-N/3C-N/4H-P Type
Specification
Item 6H-P type SiC substrate
Size 10*10mm
Thickness 330±25μm
Resistivity 0.1-0.5Ω·cm
Surface Finish Double Side Polished
Laser Mark Back side: C-Face


Customization specifications:
* Various sizes and shapes such as 5*5mm,10*10mm

* Various thicknesses: 0.1~20mm

* Various orientations such as Off-Axis:8°toward <11-20>±0.5°

* Various surface roughness such as slicing,lapping,polishing.

* Silicon carbide crystal ingots are available.


Properties
Crystal Structure Hexagonal
Lattice Constant(nm) α=3.076Å c=10.053Å
Density(g/cm³) 3.21
Melting point(℃) 2830
Mohs Hardness(mohs) 9.2
Dielectric Constant 9.66
Band Gap(eV) 3.26
Breakdown Electrical Field (MV/cm) 3.1
Thermal Conductivity(W/cm·K) 4.5
Thermal Expansion 4.7*10⁻⁶/K
Refractive Index 2.6767 ~ 2.6480
SKU: --
10*10mm 6H-P type silicon carbide wafer
Thickness
  • 350μm
Pieces
  • 1pcs
  • 10pcs
  • 25pcs
Stock: 29999997
Quantity
$0.00 ~ 200.00

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DESCRIPTION

This 10*10 mm 6H‑P‑type single‑crystal silicon carbide wafer is manufactured via crystal slicing, lapping, precision polishing and ultra‑clean cleaning to obtain epitaxy‑ready flat surface.

The 6H crystal‑polytype structure brings fine‑balanced electrical‑performance, and controllable P‑type doping delivers steady hole‑conducting property. This specimen is widely used for material testing, homo‑epitaxial growth trials, optoelectronic‑element research and small‑scale power‑device prototypes.

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